Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials. Issue 48 (31st July 2018)

• Record Type: Journal Article
• Authors: Moore, Levi M. J.; Zavala, Jacob J.; Lamb, Jason T.; Reams, Josiah T.; Yandek, Gregory R.; Guenthner, Andrew J.; Haddad, Timothy S.; Ghiassi, Kamran B.
• Is Part Of: RSC advances. Volume 8:Issue 48(2018)
• Page Start: 27400
• Page End: 27405
• Publication Date: 2018-07-31
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/c8ra05954c
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : After thermal crosslinking, bis-phenylethynyl POSS exhibits 5% mass loss temperatures approaching 600 °C, the highest of reported POSS compounds. Abstract : Bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds were synthesized and thermally cured yielding crosslinked materials. After curing at 370 °C, thermal decomposition occurs near 600 °C under nitrogen. These materials were synthesized by condensation of a new phenylethynyl-functional dichlorosilane onto tetrasilanol phenyl POSS, yielding two geometric isomers.