59‐3: Distinguished Paper: Wafer Scale Hybrid Monolithic Integration of Si‐based IC and III‐V Epilayers ‐ a Mass Manufacturable Approach for Active Matrix micro‐LED Displays. Issue 1 (30th May 2018)

• Record Type: Journal Article
• Authors: Zhang, Lei; Ou, Fang; Chong, Wing Cheung; Chen, Yijing; Zhu, Yuankun; Li, Qiming
• Is Part Of: Digest of technical papers. Volume 49:Issue 1(2018)
• Page Start: 786
• Page End: 789
• Publication Date: 2018-05-30
• Subjects: Micro-LEDs -- Hybrid monolithic integration -- Micro-display; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/sdtp.12374
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract : JBD has developed its unique wafer‐level mass manufacturable approach of monolithic hybrid integration of compound semiconductor functional device arrays on Si ICs, which enables the fabrication of hybrid chips with large device array and ultra‐fine pitch of a few micrometers. Red, green and blue active matrix micro‐LED (AMµLED) micro displays of VGA format with 1270ppi pixel resolution and 256 grayscales were successfully fabricated using JBD's monolithic hybrid integration technology. Further integration of a micro‐reflector array on the micro‐LED array significantly improves the emission directionality of the AMµLED micro display, resulting in an ultra‐high brightness of 3x10 6 nits for green AMµLED micro displays. The resultant monochromatic micro‐LED micro displays exhibit improved device performance compared to other micro display technologies and have great potentials in applications such as portable projectors and near‐to‐eye projection for augmented reality (AR). More importantly, the wafer‐scale monolithic hybrid integration technology offers a clear path for large volume, low cost mass production of hybrid opto‐electronic integrated circuit (OEIC) chips.