Cite
HARVARD Citation
Sun, F. et al. (2018). Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. Journal of materials science & technology. 34 (10), pp. 1885-1890. [Online].
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Sun, F. et al. (2018). Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. Journal of materials science & technology. 34 (10), pp. 1885-1890. [Online].