Direct manufacturing of diamond composite coatings onto silicon wafers and heat transfer performance. Issue 1 (2018)

• Record Type: Journal Article
• Authors: Lupoi, R.; Lupton, T.; Jenkins, R.; Robinson, A.J.; O'Donnell, G.E.
• Is Part Of: CIRP annals. Volume 67:Issue 1(2018)
• Page Start: 185
• Page End: 188
• Publication Date: 2018
• Subjects: Direct printing -- Diamond coating -- Cold Spray; Production engineering -- Research -- Periodicals; 670.5
• DOI: 10.1016/j.cirp.2018.04.092
• Languages: English
• ISSNs: 0007-8506

Abstract

Abstract: This paper reveals new insights on how to achieve direct deposition of functional materials onto silicon wafers for cooling purposes. Manufacturing heat spreaders directly onto a microprocessor will negate the need for Thermal Interface Materials (TIMs) which often account for the highest resistances in a typical CPU thermal circuit. In this work we demonstrate that Cold Spray can be tailored to directly print onto a silicon wafer with a layered structure of aluminum, copper and diamond. The thermal performance of the copper/diamond coating was also separately measured using an in-house testing apparatus showing heat-transfer enhancements in agreement with theoretical predictions.