Cite
HARVARD Citation
Kim, D. et al. (2018). 100 Gbps (4 × 25 Gbps) Optical Receiver Module Packaged in Chip-on-Board Based on Germanium Photodetector. Procedia engineering. pp. 144-151. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Kim, D. et al. (2018). 100 Gbps (4 × 25 Gbps) Optical Receiver Module Packaged in Chip-on-Board Based on Germanium Photodetector. Procedia engineering. pp. 144-151. [Online].