Anisotropic Strain Relaxation of Graphene by Corrugation on Copper Crystal Surfaces. Issue 22 (2nd May 2018)

• Record Type: Journal Article
• Authors: Deng, Bing; Wu, Juanxia; Zhang, Shishu; Qi, Yue; Zheng, Liming; Yang, Hao; Tang, Jilin; Tong, Lianming; Zhang, Jin; Liu, Zhongfan; Peng, Hailin
• Is Part Of: Small. Volume 14:Issue 22(2018)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-05-02
• Subjects: chemical vapor deposition -- Cu -- graphene -- strain relaxation -- wrinkles; Nanotechnology -- Periodicals; Nanoparticles -- Periodicals; Microtechnology -- Periodicals; 620.5
• DOI: 10.1002/smll.201800725
• Languages: English
• ISSNs: 1613-6810

Abstract

Abstract: Corrugation is a ubiquitous phenomenon for graphene grown on metal substrates by chemical vapor deposition, which greatly affects the electrical, mechanical, and chemical properties. Recent years have witnessed great progress in controlled growth of large graphene single crystals; however, the issue of surface roughness is far from being addressed. Here, the corrugation at the interface of copper (Cu) and graphene, including Cu step bunches (CuSB) and graphene wrinkles, are investigated and ascribed to the anisotropic strain relaxation. It is found that the corrugation is strongly dependent on Cu crystallographic orientations, specifically, the packed density and anisotropic atomic configuration. Dense Cu step bunches are prone to form on loose packed faces due to the instability of surface dynamics. On an anisotropic Cu crystal surface, Cu step bunches and graphene wrinkles are formed in two perpendicular directions to release the anisotropic interfacial stress, as revealed by morphology imaging and vibrational analysis. Cu(111) is a suitable crystal face for growth of ultraflat graphene with roughness as low as 0.20 nm. It is believed the findings will contribute to clarifying the interplay between graphene and Cu crystal faces, and reducing surface roughness of graphene by engineering the crystallographic orientation of Cu substrates. Abstract : The corrugations at the interface of Cu and graphene during chemical vapor deposition growth, including Cu step bunches and graphene wrinkles, are found to be distributed depending on Cu crystallographic orientations, especially the packed density and anisotropic atomic configuration. This phenomenon is ascribed to the anisotropic strain relaxation due to the thermal mismatch between Cu and graphene.