Cite
HARVARD Citation
Wild, P. et al. (2018). Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectronics and reliability. pp. 163-175. [Online].
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Wild, P. et al. (2018). Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectronics and reliability. pp. 163-175. [Online].