Conductive TiC/Ti–Cu/C composites fabricated by Ti–Cu alloy reactive infiltration into 3D-printed carbon performs. (July 2015)

• Record Type: Journal Article
• Authors: Rambo, Carlos R; Travitzky, Nahum; Greil, Peter
• Is Part Of: Journal of composite materials. Volume 49:Number 16(2015)
• Page Start: 1971
• Page End: 1976
• Publication Date: 2015-07
• Subjects: TiC/Ti–Cu/C composites -- Ti–Cu alloy -- 3D printing -- reactive infiltration; Composite materials -- Periodicals; Composites -- Périodiques; 620.118
• DOI: 10.1177/0021998314541307
• Languages: English
• ISSNs: 0021-9983

Abstract

The microstructure and electrical properties of dense TiC/Ti–Cu/C composites fabricated by pressureless reactive infiltration of Ti–Cu alloy into porous starch-derived carbon preforms prepared by 3D printing was evaluated. Porosities in the range of 65–78 vol% were varied by post-isostatic pressing the as-printed preforms at pressures of 50–400 MPa. The reactive melt infiltration was carried out at 1100℃ in a flowing Ar atmosphere and resulted in formation of a composite comprised predominantly of substoichiometric TiC, binary intermetallic Ti–Cu phases and residual carbon. Scanning electron microscopy analyses revealed a microstructure consisting of dispersed fine-grained TiC in a Ti–Cu matrix surrounded by a continuous carbon phase. Electrical resistivity measurements using the four-probe method were carried out and correlated to the composite microstructure. The electrical resistivity was evaluated in terms of carbon and TiC volume fractions.