Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture. (10th June 2016)

• Record Type: Journal Article
• Authors: Gu, Jiebin; Liu, Bingjie; Chen, Gaoli; Li, Xinxin
• Is Part Of: Journal of micromechanics and microengineering. Volume 26:Number 7(2016:Jul.)
• Publication Date: 2016-06-10
• Subjects: packaging -- through-silicon via -- liquid bridge; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/0960-1317/26/7/075009
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: Through-silicon via (TSV) is increasing its importance in advanced device packaging. In this paper, a through-silicon/substrate via filling method based on the combinative effect of liquid bridge rupture and capillary action is proposed and demonstrated. The proposed method is able to achieve alloy vias from the surface of a molten alloy pool. Two different processes were tested in experiments and the results show that one of these processes is able to achieve fully filled vias. In addition, a piece of equipment was specially made for the proposed via filling method. The via filling method studied in this paper has a potential application for TSVs in MEMS packaging.