Fabrication of capacitive absolute pressure sensors by thin film vacuum encapsulation on SOI substrates. (4th August 2016)

• Record Type: Journal Article
• Authors: Belsito, Luca; Mancarella, Fulvio; Roncaglia, Alberto
• Is Part Of: Journal of micromechanics and microengineering. Volume 26:Number 9(2016:Sep.)
• Publication Date: 2016-08-04
• Subjects: absolute pressure sensor -- thin film vacuum encapsulation -- SOI; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/0960-1317/26/9/095018
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: The paper reports on the fabrication and characterization of absolute capacitive pressure sensors fabricated by polysilicon low-pressure chemical vapour deposition vacuum packaging on silicon-on-insulator substrates. The fabrication process proposed is carried out at wafer level and allows obtaining a large number of miniaturized sensors per substrate on 1 × 2 mm 2 chips with high yield. The sensors present average pressure sensitivity of 8.3 pF/bar and average pressure resolution limit of 0.24 mbar within the measurement range 200–1200 mbar. The temperature drift of the sensor prototypes was also measured in the temperature range 25–45 °C, yielding an average temperature sensitivity of 67 fF K −1 at ambient pressure.