Electroless nickel plating onto Plexiglas® through simple covalent grafting of vinylpyridine seed layer. (15th April 2018)

• Record Type: Journal Article
• Authors: Vu, Ngoc Pi; Duong, Xuan Truong; Ly, Viet Anh; Nguyen, Duy Cuong; Tran, Minh Duc; Phan, Quang The; Balazinski, Marek; Son, Le Thanh; Zeb, Gul; Le, Xuan Tuan
• Is Part Of: Materials & design. Volume 144(2018)
• Page Start: 151
• Page End: 158
• Publication Date: 2018-04-15
• Subjects: Vinylpyridine grafting -- Diazonium chemistry -- Chemisorption of palladium activator -- Nickel-boron alloy -- Thin film adhesion; Materials -- Periodicals; Engineering design -- Periodicals; Matériaux -- Périodiques; Conception technique -- Périodiques; Electronic journals; 620.11
• DOI: 10.1016/j.matdes.2018.02.027
• Languages: English
• ISSNs: 0264-1275

Abstract

Abstract: The development of facile and environment friendly strategies to metallize the surface of insulating polymeric substrates is of paramount important. An acceptable film adhesion with the polymeric substrate usually requires a chemical pretreatment of the polymer surfaces. Here we report a one-step process of covalent grafting of vinylpyridine groups on the surface of commercial Plexiglas® (polymethylmethacrylate) employing diazonium-based aqueous chemistry, without requiring any surface pretreatment step. Prior to the electroless nickel plating, these grafted vinylpyridine groups can be easily activated by simply immersing the substrate into an acidic palladium chloride solution. This results in stable electrostatic interaction between the protonated pyridine functionalities and the palladium complexes. Thanks to the strong attachment to the substrate, this vinylpyridine seed layer also offers excellent adhesion between the Plexiglas® substrate and the electrolessly deposited nickel‑boron film. A sizable patterned Plexiglas® sample has been taken as a model considering its commercial potential and metallized. X-ray photoelectron spectroscopy is carried out to elucidate the mechanism of surface functionalization with pyridine groups as well as the activation of the grafted vinylpyridine seed layer. Comprehensive characterization of the electrolessly deposited metallic film is then performed by means of SEM, AFM, EDX and XPS techniques. Graphical abstract: Highlights: Vinylpyridine groups were covalently grafted on Plexiglas® through a one-step diazonium based aqueous chemical process. The vinylpyridine seed layer allowed a subsequent electroless deposition of Ni-B film on Plexiglas® with excellent adhesion. Our novel electroless metallization strategy is simple, chromium-free and industrially feasible.