Cite
HARVARD Citation
He, D. et al. (2015). A finite-element analysis of in-grain microcracks caused by surface diffusion induced by electromigration. International journal of solids and structures. pp. 248-255. [Online].
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He, D. et al. (2015). A finite-element analysis of in-grain microcracks caused by surface diffusion induced by electromigration. International journal of solids and structures. pp. 248-255. [Online].