A novel approach in organic waste utilization through biochar addition in wood/polypropylene composites. (April 2015)

• Record Type: Journal Article
• Authors: Das, Oisik; Sarmah, Ajit K.; Bhattacharyya, Debes
• Is Part Of: Waste management. Volume 38(2015)
• Page Start: 132
• Page End: 140
• Publication Date: 2015-04
• Subjects: Wood fibres/particles -- Polypropylene -- Biocomposites -- Biochar -- TGA -- SEM; Hazardous wastes -- Periodicals; Refuse and refuse disposal -- Periodicals; 363.728
• DOI: 10.1016/j.wasman.2015.01.015
• Languages: English
• ISSNs: 0956-053X

Abstract

Graphical abstract: Highlights: Biochar made from waste wood was added with wood polypropylene composites. 24% biochar gave the best mechanical properties. 6% biochar had no effect on physico-mechanical properties of composites. Coupling agent remained unreacted in composites having higher amount of biochar. Abstract: In an attempt to concurrently address the issues related to landfill gas emission and utilization of organic wastes, a relatively novel idea is introduced to develop biocomposites where biochar made from pyrolysis of waste wood ( Pinus radiata ) is added with the same wood, plastic/polymer (polypropylene) and maleated anhydride polypropylene (MAPP). Experiments were conducted by manufacturing wood and polypropylene composites (WPCs) mixed with 6 wt%, 12 wt%, 18 wt%, 24 wt%, and 30 wt% biochar. Though 6 wt% addition had similar properties to that of the control (composite without biochar), increasing biochar content to 24 wt% improved the composite's tensile/flexural strengths and moduli. The biochar, having high surface area due to fine particles and being highly carbonised, acted as reinforcing filler in the biocomposite. Composites having 12 wt% and 18 wt% of biochar were found to be the most ductile and thermally stable, respectively. This study demonstrates that, WPCs added with biochar has good potential to mitigate wastes while simultaneously producing biocomposites having properties that might be suited for various end applications.