Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing. Issue 4 (30th August 2013)

• Record Type: Journal Article
• Authors: Yang, Yong Suk; You, In‐Kyu; Han, Hyun; Koo, Jae Bon; Lim, Sang Chul; Jung, Soon‐Won; Na, Bock Soon; Kim, Hye‐Min; Kim, Minseok; Moon, Seok‐Hwan
• Is Part Of: ETRI journal. Volume 35:Issue 4(2013)
• Page Start: 571
• Page End: 577
• Publication Date: 2013-08-30
• Subjects: Organic thin‐film transistors, inkjet printing, contact via, silver ink, conductivity, penetration, LCD; Telecommunication -- Periodicals; Electronics -- Periodicals; Electronics; Telecommunication; Periodicals; Periodicals; 621.38205
• DOI: 10.4218/etrij.13.1912.0018
• Languages: English
• ISSNs: 1225-6463

Abstract

Abstract : The fabrication of a thin‐film transistor backplane and a liquid‐crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via‐hole interconnections is investigated using a semiconductor characterization system.