Copper-catalyzed oxidative amidation between aldehydes and arylamines under mild conditions. Issue 6 (4th February 2015)

• Record Type: Journal Article
• Authors: Ding, Yongzheng; Zhang, Xian; Zhang, Dongyang; Chen, Yuting; Wu, Zhibing; Wang, Peiyi; Xue, Wei; Song, Baoan; Yang, Song
• Is Part Of: Tetrahedron letters. Volume 56:Issue 6(2015)
• Page Start: 831
• Page End: 833
• Publication Date: 2015-02-04
• Subjects: Amide bond -- Copper catalyst -- Oxidative amidation -- Solvent-free -- Room temperature; Chemistry, Organic -- Periodicals; 547.005
• DOI: 10.1016/j.tetlet.2014.12.113
• Languages: English
• ISSNs: 0040-4039

Abstract

Graphical abstract: Abstract: A facile strategy to prepare amide bonds has been developed. A series of amide compounds, including heterocyclic amide compounds, were obtained with moderate to good yields ranging from 31–88% by using copper iodide (CuI) to catalyze the oxidative amidation between aldehydes and amines under solvent-free conditions at room temperature in air.