Enhancing wear resistance of Cu–Al alloy by controlling subsurface dynamic recrystallization. (May 2015)

• Record Type: Journal Article
• Authors: Chen, X.; Han, Z.; Lu, K.
• Is Part Of: Scripta materialia. Volume 101(2015)
• Page Start: 76
• Page End: 79
• Publication Date: 2015-05
• Subjects: Copper alloys -- Nanostructure -- Worn subsurface microstructure -- Dynamic recrystallization -- Wear; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2015.01.023
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract : The sliding wear resistance of Cu-2.2 wt.% Al alloy can be remarkably enhanced by controlling subsurface dynamic recrystallization (DRX) process. The wear volume decreases from 3.1 × 10 7 to 0.9 × 10 7 μm 3 when the DRX grain size increases from 0.28 to 0.62 μm induced by dynamic plastic deformation and subsequent annealing. The enhanced wear resistance stems from a wear mechanism transition from cracking and peeling-off of the fine-grained DRX layer to that of the topmost nanostructured mixing layer as DRX grains become coarser.