Cite
HARVARD Citation
Lim, W. et al. (2018). Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis. Microelectronics international. 35 (1), pp. 33-44. [Online].
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Lim, W. et al. (2018). Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis. Microelectronics international. 35 (1), pp. 33-44. [Online].