Enhancing the Retention Force of Press‐Fit Connections by Ultrasonic Excitation. Issue 6 (30th January 2018)

• Record Type: Journal Article
• Authors: Halm, Cynthia; Otto, Andreas; Stark, Tilman; Schaaf, Peter
• Is Part Of: Physica status solidi. Volume 215:Issue 6(2018)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-01-30
• Subjects: copper -- material bond -- press‐fit -- retention force -- ultrasonic excitations; Solid state physics -- Periodicals; Solids -- Industrial applications -- Periodicals; 530.41
• DOI: 10.1002/pssa.201700598
• Languages: English
• ISSNs: 1862-6300

Abstract

Abstract : Press‐fit technology is a well‐known process in electrical joining and connecting. This process is combined with a subsequent ultrasonic excitation of the printed circuit board (PCB) to enhance the retention force. No additional temperature treatment is necessary because the holding force increases directly after the process. It is discussed how the amplitude and the duration of ultrasonic excitation determine the resulting retention force. A suitable set of parameters is found to increase the retention force. The materials details of the bonds are analyzed. Two models are created to explain the results. These models can be used to predict the retention force for further investigations with changed geometries or materials. Abstract : To enhance the retention force of a press‐fit connection, ultrasonic excitation is used. The microstructure of the joining zone between pin and PTH is analyzed. Two models are developed to predict the press out force and explain the background of the increased force.