Cu Nanospring Films for Advanced Nanothermal Interfaces. Issue 3 (23rd January 2018)

• Record Type: Journal Article
• Authors: Antartis, Dimitrios A.; Mott, Ryan N.; Das, Debashish; Shaddock, David; Chasiotis, Ioannis
• Is Part Of: Advanced engineering materials. Volume 20:Issue 3(2018)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-01-23
• Subjects: Compliant films -- Glancing angle deposition -- Thermal conductivity -- Thermal mismatch -- Toughness; Materials -- Periodicals; 620.11
• DOI: 10.1002/adem.201700910
• Languages: English
• ISSNs: 1438-1656

Abstract

Abstract : An advanced thermal interface material comprised of dense and orderly arrays of 10‐µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm 2 KW −1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus. Abstract : Advanced thermal interface of dense arrays of 10 µm high Cu nanosprings, with tunable normal and shear compliance and lateral stability due to spring intertwining. The Cu nanospring films have the compliance of soft polymers but 10–100 times higher thermal conductivity. The unique combination of mechanical and thermal properties makes it possible to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.