Cite
HARVARD Citation
Bertelli, F. et al. (n.d.). Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys. Materials & design. pp. 31-42. [Online].
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Bertelli, F. et al. (n.d.). Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys. Materials & design. pp. 31-42. [Online].