Multi-shot flash lamp annealing method for electroless-plated Ni-P film on UV-surface-modified ABS. (4th March 2018)

• Record Type: Journal Article
• Authors: Miyazeki, Y.; Suzuki, Y.; Horiuchi, Y.; Noh, J.-H.; Honma, H.; Arakawa, T.
• Is Part Of: Transactions of the Institute of Metal Finishing. Volume 96:Number 2(2018)
• Page Start: 103
• Page End: 107
• Publication Date: 2018-03-04
• Subjects: Rapid annealing method -- multi-shot flash lamp annealing -- electroless Ni-P plating -- UV surface modification -- ABS substrate; Metals -- Finishing -- Periodicals; Metals -- Surfaces -- Periodicals; Metallurgy -- Periodicals; 671.705
• DOI: 10.1080/00202967.2018.1419620
• Languages: English
• ISSNs: 0020-2967

Abstract

ABSTRACT: The multi-shot flash lamp annealing (FLA) method as a rapid annealing technique was developed for an electroless-plated Ni-P film on UV-surface-modified acrylonitrile–butadiene-styrene (ABS) in place of the conventional annealing method. The new multi-shot FLA method continuously irradiates a Xe flash discharge with low irradiance (<1 J cm –2 ) with a frequency of 3 Hz. An adhesion strength between the electroless Ni-P film and ABS of more than 1.2 kN m –1 was achieved in a short time of approximately 30 s; this adhesion strength was larger than that obtained in the conventional method of 1 h duration. The etching effect of the FLA method was assessed by a study of the surface morphologies of the Ni-P films. XRD spectra of the Ni-P films showed an improvement in the crystallinity of the films. Considering surface elemental analyses of the peeled Ni-P-film/ABS, a cohesive failure, which implies high adhesion, was observed in the ABS. The proposed FLA method is expected to efficiently improve the adhesion and significantly reduce the annealing time in the electroless plating process.