Acoustic emission method to study fracture (Mode-I, II) and residual strength characteristics in composite-to-metal and metal-to-metal adhesively bonded joints. Issue 5 (16th April 2018)

• Record Type: Journal Article
• Authors: Droubi, Mohamad Ghazi; Stuart, Alan; Mowat, John; Noble, Craig; Prathuru, Anil Kumar; Faisal, Nadimul Haque
• Is Part Of: Journal of adhesion. Volume 94:Issue 5(2018)
• Page Start: 347
• Page End: 386
• Publication Date: 2018-04-16
• Subjects: Acoustic emission -- adhesive materials -- destructive testing -- failure modes (Mode-I -- II) -- fracture mechanics -- interfacial fracture -- residual strength; Adhesion -- Periodicals; 541.33
• DOI: 10.1080/00218464.2017.1278696
• Languages: English
• ISSNs: 0021-8464

Abstract

ABSTRACT: Failure behaviour of two types of adhesively bonded joints (composite-to-metal, metal-to-metal) has been studied under failure modes (Mode I: double cantilever beam (DCB) and Mode II: three-point end notch flexures (3-ENF)) using acoustic emission (AE) technique. The bonded specimens were prepared using two types of adhesive bond materials with three variations of adhesive bond quality. The effect of the presence of interfacial defects along the interface on the residual strength of the joint has also been studied. It was possible using the maximum AE amplitude method to select the AE events of mechanical significance. However, it proved difficult to propose a definitive AE trait for the mechanical phenomena occurring within specific AE event signals, for all adhesive types, bond qualities, and substrate configurations, therefore, all specimen combinations. There was a notable shift in spectral energy proportion as the AE source of mechanical significance varied along the specimen length for specimen combinations. However, it was difficult to confirm this distinctive trait for all specimen combinations due to difficulty in confirming the location and exact mechanical source. The proposed measurement technique can be useful to assess the overall structural health of a bonded system and may allow identification of defects.