Factors Influencing the Temperature Distribution of 200 W Light Emitting Diode Module Used in the Spotlight. Issue 6 (3rd April 2018)

• Record Type: Journal Article
• Authors: Zhou, Jicheng; Chen, Xing; Zhou, Zhuang; Peng, Yinqiao; Wang, Yunyun; Huang, Jinhui
• Is Part Of: Heat transfer engineering. Volume 39:Issue 6(2018)
• Page Start: 493
• Page End: 498
• Publication Date: 2018-04-03
• Subjects: Heat -- Transmission -- Periodicals; 621.4022
• DOI: 10.1080/01457632.2017.1320095
• Languages: English
• ISSNs: 0145-7632

Abstract

ABSTRACT: The junction temperature of LED (light emitting diode) has a significant impact on its performance and lifetime. In this paper, a simplified model based on the finite element analysis is developed to simulate the temperature distribution of the 200 W LED module using software ANSYS. The model contains LED package, the heat pipe radiator, as well as TIM (thermal interface material) between the LED package and radiator. The temperature distribution of the simulation agrees with that of the experimental measurement. Thickness of TIM affects the heat dissipation significantly, the chips temperature and the maximum temperature difference of chips increases sharply with TIM thickness increasing. Substituting aluminum fins with copper fins cannot improve the heat dissipation performance of heat pipe radiator, and the air velocity of heat pipe radiator plays a key role in the heat dissipation. Thermal conductivity of package submount directly affects the chip temperature and the uniformity of temperature distribution of package submount.