Charge transfer during H/H− collisions with Cu(100) and Cu(111) surfaces. (28th November 2017)

• Record Type: Journal Article
• Authors: Bahrim, B.; Stafford, J.; Makarenko, B.
• Is Part Of: Surface and interface analysis. Volume 50:Number 2(2018)
• Page Start: 212
• Page End: 219
• Publication Date: 2017-11-28
• Subjects: charge transfer -- ion fractions -- ion/atom scattering -- ion‐surface interactions -- survival probability; Surfaces (Physics) -- Periodicals; Surface chemistry -- Periodicals; Thin films -- Periodicals; 541.33
• DOI: 10.1002/sia.6360
• Languages: English
• ISSNs: 0142-2421

Abstract

Abstract : We study the H and H − survival probabilities during collisions with Cu(100) and Cu(111) surfaces, at energies ranging from 0.5 to 5 keV and exit angles ranging from 20° to 90°. Calculations are performed with the Wave‐Packet Propagation method adapted to ion‐surface interactions. The projectile survival probability depends on the perpendicular velocity and the copper face being investigated. Projectile's interaction time with the surface and the distance of closest approach are important factors that influence the survival. The H − survival on Cu(100) is much smaller than on Cu(111) but only at low velocities, while becoming higher or comparable to Cu(111) for higher velocities. For very fast collisions, the copper surface behaves like a jellium, and the electron involved in charge transfer does not "feel" the particularities of the surface band structure anymore. While the H survival on Cu(100) seems to not depend on energy and exit angle, the H survival on Cu(111) is both energy and angle dependent, and it is smaller. The study of partial density of states indicates that strong atom‐surface interactions at short distances and the role played by surface states are important factors in determining the neutral fractions obtained after scattering.