Cite
HARVARD Citation
Magnien, J. et al. (2017). Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. Microelectronics and reliability. pp. 601-605. [Online].
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Magnien, J. et al. (2017). Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. Microelectronics and reliability. pp. 601-605. [Online].