Cite
HARVARD Citation
Hong, J. et al. (2018). Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering. Journal of adhesion science and technology. 32 (7), pp. 753-771. [Online].
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Hong, J. et al. (2018). Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering. Journal of adhesion science and technology. 32 (7), pp. 753-771. [Online].