A novel MRTD model for signal integrity analysis of resistive driven coupled copper interconnects. Issue 1 (2nd January 2018) - Rebelli, Shashank
Abstract : Purpose: This paper aims to model the coupled on-chip Copper (Cu) interconnects by using the multiresolution time-domain (MRTD) method. Design/methodology/approach: The proposed model is a wavelet-based numerical method for analyzing signal integrity and propagation delay of coupled on-chip interconnects. Moreover, the dependency of crosstalk noise and delay on coupling parasitics (L12, C12) are analyzed. Findings: The proposed MRTD method captures the behaviour of propagation delay and peak crosstalk noise on victim line against coupling parasitics, which is in close agreement with that of H simulation program with integrated circuit emphasis (HSPICE). The average error for the proposed model is less than 1 per cent with respect to HSPICE for the estimation of peak crosstalk noise voltage. Practical implications: Simulations are performed using HSPICE and compared with those performed using the proposed MRTD method for global interconnect length with 130-nm technology, where the computations of the proposed model are carried out using Matlab. Originality/value: The MRTD method with its unique features is tailored for modelling interconnects. To build further credence to this and its profound existence in the latest state-of-art works, simulations of crosstalk noise and propagation delay, for coupled Cu interconnect lines, using MRTD and finite-difference time-domain (FDTD) are executed. The results illustrated the dominance of MRTD method over FDTD in terms of accuracy.