Encapsulation and microwave hybrid processing of Al 6061–Graphene–SiC composites. Issue 1 (2nd January 2018)

• Record Type: Journal Article
• Authors: Prashantha Kumar, H. G.; Anthony Xavior, M.
• Is Part Of: Materials and manufacturing processes. Volume 33:Issue 1(2018)
• Page Start: 19
• Page End: 25
• Publication Date: 2018-01-02
• Subjects: Composites -- encapsulation -- graphene -- hardness -- microstructure -- microwave -- sintering -- ultrasonication; Manufacturing processes -- Periodicals; Materials -- Periodicals; Manufactured Materials; 670.5
• DOI: 10.1080/10426914.2017.1279320
• Languages: English
• ISSNs: 1042-6914

Abstract

ABSTRACT: The demand for new aluminum alloy–based metal matrix composites with combinations of novel reinforcements, processed through innovative methods are very much needed for critical engineering applications. With this perspective, the current research work is aimed at the development of Al 6061 composites reinforced with two-dimensional Graphene nanoflake-encapsulated SiC. Ultrasonic liquid processing method is used to disperse the Graphene flake and the mixture is ball milled by adding SiC to achieve the encapsulation. Subsequently, the Al 6061 powder is added to the milled mixture and consolidated through uniaxial vacuum hot press followed by microwave hybrid sintering. Scanning electron microscope (SEM) analysis, X-ray diffraction analysis, hardness, density, and microstructure analysis were carried out on developed composites. Raman analysis was carried out to analyze the distortion on Graphene physical structure during various processing stages. Further, effects on novel combination of material with combined processing approach on flexural and tribological behavior have been analyzed.