An Application of Diazonium‐Induced Anchoring Process in the Fabrication of Micro‐Electromechanical Systems. Issue 12 (20th October 2017)

• Record Type: Journal Article
• Authors: Zeb, Gul; Zafar, Madiha; Palacin, Serge; Le, Xuan Tuan
• Is Part Of: Advanced materials technologies. Volume 2:Issue 12(2017)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2017-10-20
• Subjects: amination -- coating thickness -- electroless nickel -- metallization -- organic coating; Materials science -- Periodicals; Technological innovations -- Periodicals; Materials science; Technological innovations; Periodicals; 620.1105
• DOI: 10.1002/admt.201700159
• Languages: English
• ISSNs: 2365-709X

Abstract

Abstract: In situ generation of diazonium cations and their subsequent reduction and grafting is a versatile technique to modify a variety of substrates. In the absence of a conducting substrate, the grafting of aminophenylene layer can be achieved with assistance of a reducing agent (diazonium‐induced anchoring process—DIAP). Here, a systematic investigation of the possible effect of the type substrate on the thickness of aminophenyl layer is carried out using Fe powder reducing agent. The study is carried out on three different substrates: p‐doped Si, TiN, and Cu films and concludes that the film‐growth mechanism is independent of the type of substrate. This work is particularly important for many industrial applications, which require unifying a single film deposition process for multiple structural materials. The first results obtained with mechanical Si test structures clearly show that surface amination at room temperature, in open air, and aqueous medium using DIAP can be easily integrated into the fabrication of microelectromechanical systems and, therefore, can potentially replace the currently industrialized organic‐based silanization process. Abstract : A diazonium‐induced anchoring process can be applied where a uniform thickness of organic coating is required on a variety of substrates. This process is used to devise a completely aqueous route of chemical metallization of microelectromechanical systems (MEMS) structures. The process is simple, cost‐effective, manufacturable, and can potentially replace the organic‐based silanization process for metallization in MEMS.