Cite
HARVARD Citation
Lee, J. et al. (2017). Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles. Journal of materials chemistry. 5 (47), pp. 12507-12512. [Online].
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Lee, J. et al. (2017). Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles. Journal of materials chemistry. 5 (47), pp. 12507-12512. [Online].