A dismantlable photoadhesion system fabricated by an anionic UV curing of epoxy resins with a base amplifier having a disulfide bond. Issue 2 (11th November 2017)

• Record Type: Journal Article
• Authors: Furutani, Masahiro; Kakinuma, Ayaru; Arimitsu, Koji
• Is Part Of: Journal of polymer science. Volume 56:Issue 2(2018)
• Page Start: 237
• Page End: 241
• Publication Date: 2017-11-11
• Subjects: adhesion -- irradiation -- networks -- resins -- shear; 547
• DOI: 10.1002/pola.28898
• Languages: English
• ISSNs: 0887-624X

Abstract

ABSTRACT: A base amplifier (BA) that autocatalytically generates a diamine having a disulfide bond has been developed. Diamines generated from this BA are integrated into cross‐linked networks of epoxy resins that also have disulfide bonds. Anionic UV curing is performed using a photobase generator, the BA and the epoxy resins, and cured films are obtained after UV irradiation and subsequent heating at 160 °C. Furthermore, this curing system is applied successfully to adhesion of two stainless substrates, which is cancelled with gentle heating and a shear force. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem.2018, 56, 237–241 Abstract : A base amplifier (BA) that generates a diamine having a disulfide bond has been developed. Anionic UV curing of epoxy resins is performed using this BA, leading to photoadhesion and subsequent thermal dismantlement.