Cycle time analysis of dual-arm cluster tools for wafer fabrication processes with multiple wafer revisiting times. (January 2015)

• Record Type: Journal Article
• Authors: Qiao, Yan; Wu, NaiQi; Zhu, QingHua; Bai, LiPing
• Is Part Of: Computers & operations research. Volume 53(2015)
• Page Start: 252
• Page End: 260
• Publication Date: 2015-01
• Subjects: Scheduling -- Cluster tools -- Semiconductor manufacturing -- Petri net; Operations research -- Periodicals; Electronic digital computers -- Periodicals; 004.05
• DOI: 10.1016/j.cor.2014.03.024
• Languages: English
• ISSNs: 0305-0548

Abstract

Abstract: For some wafer fabrication processes, the wafers need to visit some processing modules for a number of times, which is referred to as the revisiting process. With wafer revisiting, it is very complicated to analyze the cycle time of a dual-arm cluster tool. Due to the fact that atomic layer deposition (ALD) process is a typical revisiting process in the semiconductor industry, study is conducted on cycle time analysis of dual-arm cluster tools for the ALD process with multiple revisiting times. The system is modeled by a type of Petri net. With this model, it is revealed that the system may never reach a steady state. Based on this finding, a method is presented to analyze the cycle time and analytical expressions are derived to calculate the cycle time for different cases. Several illustrative examples are given to show the applications of the proposed approach.