Study on Texture Evolution and Deformation Mechanism of the Cu-Ni-Si Alloy during Cold-rolling Treatment. (2017)

• Record Type: Journal Article
• Authors: Wei, He; Chen, Yin-li; Su, Lan; Tang, Di; Xu, Zhi-jun
• Is Part Of: Procedia engineering. Volume 207(2017)
• Page Start: 1111
• Page End: 1116
• Publication Date: 2017
• Subjects: Cu-Ni-Si alloy -- texture -- microstructural -- microbands -- twinning; Engineering -- Congresses; Engineering -- Periodicals; Engineering; Conference proceedings; Periodicals; 620.005
• DOI: 10.1016/j.proeng.2017.10.1068
• Languages: English
• ISSNs: 1877-7058

Abstract

Abstract: The maximum potential can be discovered by controlling the texture's species and components for high strength and high elasticity and high conductivity Cu-Ni-Si materials. Texture composition and evolution of Cu-Ni-Si alloy at different cold-rolling deformations was investigated by means of the inverse pole figure and the crystal orientation distribution function (ODF). The microstructural inhomogeneities, such as microbands and twinning in Cu-Ni-Si rolling have been studied, and the deformation processes and their contributions to the rolling textures have also been analyzed. The results showed that the cold rolled texture contained Brass orientation (mainly {211} <111>), S orientation (mainly {123} <634>), Goss orientation and Copper orientation. In addition, Copper orientation transformed to Brass orientation with the increase of cold reduction rate. When the reduction rate was 40%, there appeared a large number of microbands. While the reduction rate increased to 80%, there occurred plenty of twinning/matrix layered structures and the crystal orientation mainly gathered close to B{011} <211> orientation. The formation of microbands caused no severe texture change. However, twinning was responsible for the transit of texture type. The high cold-rolling deformation was beneficial to the formation and development of twinning and Brass texture, and the low cold-rolling deformation was beneficial to the formation and development of microbands and Copper texture.