Transient thermal response of a functionally graded piezoelectric laminate with a crack normal to the bimaterial interface. Issue 1 (2nd January 2018)

• Record Type: Journal Article
• Authors: Ueda, Sei; Okada, Masayuki; Nakaue, Yoshihisa
• Is Part Of: Journal of thermal stresses. Volume 41:Issue 1(2018)
• Page Start: 98
• Page End: 118
• Publication Date: 2018-01-02
• Subjects: Elasticity -- fracture mechanics -- functionally graded piezoelectric material -- integral transform -- normal crack -- stress intensity factor -- transient response; Thermal stresses -- Periodicals; 620.1121
• DOI: 10.1080/01495739.2017.1361801
• Languages: English
• ISSNs: 0149-5739

Abstract

ABSTRACT: In this article, the problem of a functionally graded piezoelectric material strip (FGPM strip) containing a crack perpendicular to the interface between the FGPM strip and a homogeneous layer is analyzed under transient thermal loading condition. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the interface. Using the Laplace and Fourier transforms, the thermoelectromechanical problem is reduced to a singular integral equation, which is solved numerically. The stress intensity factors of embedded and edge cracks are computed. The results for the crack contact problem are also included.