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HARVARD Citation
Zhang, J. et al. (2018). Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point. Materials & design. pp. 473-480. [Online].
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Zhang, J. et al. (2018). Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point. Materials & design. pp. 473-480. [Online].