A design of the Micro-Plate Loop Heat Pipe and development of the porous nickel capillary wick. (2017)

• Record Type: Journal Article
• Authors: Chen, Ziang; Tong, Xinghua; Liu, Hai; Guo, Chunsheng; Qu, Fangyi; Cong, Huisheng
• Is Part Of: Procedia engineering. Volume 205(2017)
• Page Start: 3931
• Page End: 3937
• Publication Date: 2017
• Subjects: Micro-Plate Loop Heat Pipe -- nickel powder -- capillary wick -- sintering; Engineering -- Congresses; Engineering -- Periodicals; Engineering; Conference proceedings; Periodicals; 620.005
• DOI: 10.1016/j.proeng.2017.10.031
• Languages: English
• ISSNs: 1877-7058

Abstract

Abstract: This paper designs and discusses a Micro-Plate Loop Heat Pipe which is suitable for the heat dissipation of various electronic chips, discusses and explains details of the loop heat pipe components. This paper also discovers the reliable sintering temperature and thermal insulation time for a sintering porous capillary wick which is made up of nickel powder using the method of cold pressure forming and sintering with vacuum protection. It can lay a solid foundation for the development of efficient Micro-Plate Loop Heat Pipe equipment. It is also important for circular heat pipe further research and development.