Internal stress control of transition-metal thin films. (May 2015)

• Record Type: Journal Article
• Authors: Toyoda, R.; Tawata, M.; Hashimoto, M.; Matsumura, Y.
• Is Part Of: Materials research innovations. Volume 19(2015)Supplement 5
• Page Start: S5-325
• Page End: S5-327
• Publication Date: 2015-05
• Subjects: Sputtered thin film -- Ion bombardment -- Ion momentum -- Internal stress; Materials -- Research -- Periodicals; Matériaux -- Recherche -- Périodiques; 620.1105
• DOI: 10.1179/1432891714Z.0000000001103
• Languages: English
• ISSNs: 1432-8917

Abstract

Abstract : The characteristics of sputtered thin films are affected by ion bombardment during sputter deposition. An ion bombardment parameter P i, which is based on the magnitude of the ion momentum and the impingement ratio of ions to metal particles, has been previously proposed as a means of expressing the effects of ion bombardment. In this study, the effects of ion bombardment parameter P i on the internal stress of thin films were evaluated. Consequently, the internal stress of Ni and Cu thin films were observed to increase linearly with the increase of P i ; however, a Mo thin film exhibited the converse result. The results presented herein indicate that the characteristics of thin films, irrespective of the target, can be controlled via manipulation of parameter P i .