Cite
HARVARD Citation
Ahn, K. et al. (2017). Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments. Microelectronics and reliability. pp. 1-10. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Ahn, K. et al. (2017). Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments. Microelectronics and reliability. pp. 1-10. [Online].