Cite
HARVARD Citation
Kung, H. et al. (2017). A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. Microelectronics and reliability. pp. 272-279. [Online].
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Kung, H. et al. (2017). A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. Microelectronics and reliability. pp. 272-279. [Online].