Cite
HARVARD Citation
, . et al. (2014). A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads. Engineering computations. 31 (3), pp. 467-489. [Online].
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, . et al. (2014). A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads. Engineering computations. 31 (3), pp. 467-489. [Online].