Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 °C. Issue 5 (28th February 2014)

• Record Type: Journal Article
• Authors: Wei, Shen-Hung; Lin, Chien-Cheng
• Is Part Of: Journal of materials research. Volume 29:Issue 5(2014)
• Page Start: 684
• Page End: 694
• Publication Date: 2014-02-28
• Subjects: Materials -- Research -- Periodicals; 620.1105
• DOI: 10.1557/jmr.2014.30
• Languages: English
• ISSNs: 0884-2914

Abstract

Abstract: Abstract : In this study, 3 mol% Y2 O3 -stabilized zirconia (3Y–ZrO2 ) and commercially pure titanium (cp-Ti) joints were fabricated with an Ag68.8 Cu26.7 Ti4.5 interlayer (Ticusil) at 900 °C for various brazing periods. After brazing at 900 °C/0.1 h, Ti2 Cu, TiCu, Ti3 Cu4, and TiCu4 layers were present at the Ti/Ticusil interface, while TiCu and TiO layers were observed at the Ticusil/3Y–ZrO2 interface. In the residual interlayer, clumpy TiCu4 was formed along with the Ag solid phase. After brazing at 900 °C/1 h, Ti3 Cu3 O and Ti2 O layers were formed at the interlayer/ZrO2 interface, while Cu2 O was precipitated in the residual interlayer with $\left[ {111} \right]_{{\rm{Cu}}_{\rm{2}} {\rm{O}}} //\left[ {111} \right]_{{\rm{Ag}}}$ and $\left( {20\bar 2} \right)_{{\rm{Cu}}_{\rm{2}} {\rm{O}}} //\left( {20\bar 2} \right){}_{{\rm{Ag}}}$ . After brazing at 900 °C/6 h, a two-phase (α-Ti + Ti2 Cu) region was observed on the Ti side with $\left[ {2\bar 1\bar 10} \right]_{{\rm{\alpha - Ti}}} //\left[ {100} \right]_{{\rm{Ti}}_{\rm{2}} {\rm{Cu}}}$ and $\left( {0002} \right)_{{\rm{\alpha - Ti}}} //\left( {0\bar 13} \right)_{{\rm{Ti}}_{\rm{2}} {\rm{Cu}}}$, while the TiCu layer grew at the expense of Ti3 Cu4 and TiCu4 . The bonding mechanisms and diffusion paths were explored with the aid of Ag–Cu–Ti and Ti–Cu–O ternary phase diagrams.