Cite
HARVARD Citation
Chen, Y. et al. (2017). Coupling damage and reliability modeling for creep and fatigue of solder joint. Microelectronics and reliability. pp. 233-238. [Online].
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Chen, Y. et al. (2017). Coupling damage and reliability modeling for creep and fatigue of solder joint. Microelectronics and reliability. pp. 233-238. [Online].