Experimental evaluation of cooling performance of circular heat sinks for heat dissipation from electronic chips using nanofluid. (September 2017)

• Record Type: Journal Article
• Authors: Ghasemi, Seyed Ebrahim; Ranjbar, A.A.; Hosseini, M.J.
• Is Part Of: Mechanics research communications. Volume 84(2017)
• Page Start: 85
• Page End: 89
• Publication Date: 2017-09
• Subjects: Experimental evaluation -- Cooling performance -- Heat sink -- Nanofluid -- Electronic chips; Mechanics, Applied -- Periodicals; Mécanique appliquée -- Périodiques; Mechanics, Applied; Periodicals; 530
• DOI: 10.1016/j.mechrescom.2017.06.009
• Languages: English
• ISSNs: 0093-6413

Abstract

Highlights: Nanofluid flow in a heat sink is investigated experimentally. By addition of nanoparticles the heat dissipation is improved. Thermal resistance decreases with increase of nanoparticles volume fraction. Abstract: In this work, an experimental investigation on cooling performance of using nanofluid to replace the pure water as the coolant in a minichannel heat sink is conducted. The heat sink comprises of four circular channels with hydraulic diameter of 6 mm. Thermal and hydraulic performances of the nanofluid cooled minichannel heat sink are evaluated from the results obtained for the Nusselt number, friction factor, thermal resistance and pumping power, with the volume flow rate ranging from 0.3 to 1.5 L/min. The experimental results show that the nanofluid cooled heat sink outperforms the water-cooled one, having significantly higher average heat transfer coefficient. Despite the marked increase in dynamic viscosity due to dispersing the nanoparticles in water, the friction factor for the nanofluid-cooled heat sink is found slightly increased only.