Cite
HARVARD Citation
Jia, Z. et al. (2017). Dielectrophoretic assembly of dimpled colloids into open packing structures. Soft matter. 13 (34), pp. 5724-5730. [Online].
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Jia, Z. et al. (2017). Dielectrophoretic assembly of dimpled colloids into open packing structures. Soft matter. 13 (34), pp. 5724-5730. [Online].