Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method. Issue 34 (21st August 2017)

• Record Type: Journal Article
• Authors: Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong
• Is Part Of: Journal of materials chemistry. Volume 5:Issue 34(2017)
• Page Start: 8707
• Page End: 8713
• Publication Date: 2017-08-21
• Subjects: Materials -- Periodicals; Chemistry, Analytic -- Periodicals; Optical materials -- Research -- Periodicals; Electronics -- Materials -- Research -- Periodicals; 543.0284
• DOI: 10.1039/c7tc01668a
• Languages: English
• ISSNs: 2050-7526

Abstract

Abstract : Nanoscale semiconductor building blocks can be controllably soldered together via a novel in situ SEM-FIB thermal soldering technique. Abstract : Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.