Cite
HARVARD Citation
Yi, Z. et al. (2017). Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology. Nanoscale. 9 (34), pp. 12524-12532. [Online].
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Yi, Z. et al. (2017). Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology. Nanoscale. 9 (34), pp. 12524-12532. [Online].