Fully‐Inkjet‐Printed Ag‐Coil/NiZn‐Ferrite for Flexible Wireless Power Transfer Module: Rigid Sintered Ceramic Body into Flexible Form. (26th June 2017)

• Record Type: Journal Article
• Authors: Bissannagari, Murali; Lee, Woosung; Lee, Woong Yong; Jeong, Jun Hwan; Kim, Jihoon
• Is Part Of: Advanced functional materials. Volume 27:Number 31(2017)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2017-06-26
• Subjects: embedding of fully sintered ferrite film -- ferrite -- flexible inductors -- inkjet printing -- wireless power transfer; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adfm.201701766
• Languages: English
• ISSNs: 1616-301X

Abstract

Abstract : Despite the material performances being superior to those of organic materials, inorganic materials are typically excluded for use in flexible and deformable electronic systems because of their rigid nature and the requirement for high processing temperature. This work presents a novel method of utilizing rigid NiZn‐ferrite films in a flexible platform and offers an opportunity to realize a flexible wireless power transfer (WPT) module. Inkjet printing is introduced in this study since it can coat NiZn‐ferrite films as well as pattern inductor coils for WPTs. A thermochemically inert buffer layer is selected based on a thermodynamic analysis and is introduced as a buffer layer for the NiZn‐ferrite to prevent chemical reaction between the ferrite film and the substrate and ensure that the ferrite film can be easily separated from the substrate during a high‐temperature sintering process. A Ag‐inductor coil is printed on the NiZn‐ferrite layer, and then the entire layer is embedded into polydimethylsiloxane, which renders the WPT module flexible. The flexibility of the WPT module is characterized by a bending test, and the structural and magnetic properties are also investigated. The performance of the flexible WPT module is demonstrated by transmitting wireless power to a light emitting diode. Abstract : A flexible wireless power transfer (WPT) module is prepared by embedding a Ag‐inductor coil/NiZn‐ferrite layer into polydimethylsiloxane. This work presents a creative method to utilize a rigid ferrite film in a flexible platform for future flexible electronics. The performance of the flexible WPT module is demonstrated by transmitting a wireless power to a light emitting diode.