Package-embedded spiral inductor characterization with application to switching buck converters. (August 2017)

• Record Type: Journal Article
• Authors: Yan, Chen; Gan, Zhihua; Salman, Emre
• Is Part Of: Microelectronics journal. Volume 66(2017)
• Page Start: 41
• Page End: 47
• Publication Date: 2017-08
• Subjects: Characterization -- Electromagnetic modeling -- Package embedded inductors -- Organic flip-chip packaging -- Multi-phase buck converter -- Power efficiency; Microelectronics -- Periodicals; Microélectronique -- Périodiques; Microelectronics; Electronic journals; Journals - contents and abstracts; Periodicals; 621.3805
• DOI: 10.1016/j.mejo.2017.05.016
• Languages: English
• ISSNs: 0959-8324

Abstract

Abstract: The design and characterization process of a package-embedded spiral inductor is investigated in this paper via comprehensive electromagnetic simulations. A realistic, multi-layer flip-chip package is considered and modeled in a commercial, full wave electromagnetic simulator. At constant package area, parasitic resistance of a given inductance is minimized. The applicability of the proposed package-embedded spiral inductor to a DC-DC switching buck converter is demonstrated. The flexibility of the package is exploited to obtain a relatively high inductance, enabling a reduced switching frequency. Lower switching frequency minimizes the dynamic loss, thereby increasing the power efficiency. An interleaved multi-phase buck regulator with an array of package-embedded spiral inductors is developed. The extracted layout of the overall circuit is evaluated for performance and primary characteristics. The converter produces an output voltage of 0.9 V from 1.2 V input voltage while supplying a load current of 1 A. Power efficiency of approximately 89% is achieved with 3% output ripple voltage.