Microstructure and electrical properties of SiC dispersed molybdenum silicide composite. (26th May 2016)

• Record Type: Journal Article
• Authors: Byun, J. M.; Bang, S.-R.; Kim, S. H.; Kim, Y. D.
• Is Part Of: Powder metallurgy. Volume 59:Number 3(2016)
• Page Start: 197
• Page End: 202
• Publication Date: 2016-05-26
• Subjects: Molybdenum silicide -- Silicon carbide -- Composite -- Electrical resistance -- Sintering; Powder metallurgy -- Periodicals; 671.3705
• DOI: 10.1080/00325899.2016.1142725
• Languages: English
• ISSNs: 0032-5899

Abstract

Abstract : In this study, a core–shell composite powder with Mo as the shell material and β-SiC as the core material was produced via chemical vapour transport caused by the hydrogen reduction of Mo oxide. Using this core–shell composite powder, a Mo silicide composite with uniformly dispersed β-SiC was fabricated by pressureless sintering at 1400°C. The relative density of specimens sintered for 10 hours was 96.1% and the electrical resistivity was 4.68 × 10 −5 Ω m. It was concluded that a β-SiC dispersed molybdenum silicide composite with enhanced electrical resistivity was successfully fabricated at a relatively low sintering temperature using the core–shell composite powder.