Combining the crack compliance method and speckle interferometry data for determination of stress intensity factors and T-stresses. (15th June 2017)

• Record Type: Journal Article
• Authors: Pisarev, V.S.; Matvienko, Y.G.; Eleonsky, S.I.; Odintsev, I.N.
• Is Part Of: Engineering fracture mechanics. Volume 179(2017)
• Page Start: 348
• Page End: 374
• Publication Date: 2017-06-15
• Subjects: Crack tip displacement fields -- CMOD -- Stress intensity factor -- T-stress -- Electronic speckle-pattern interferometry -- Residual stress field; Fracture mechanics -- Periodicals; Rupture, Mécanique de la -- Périodiques; Fracture mechanics; Periodicals; 620.112605
• DOI: 10.1016/j.engfracmech.2017.04.029
• Languages: English
• ISSNs: 0013-7944

Abstract

Highlights: Crack modeling by a sequence of narrow notches. Recording strain-induced interference fringe patterns. Displacement measurements on crack borders immediately including CMOD and COD. Determination of the first four coefficients of Williams' series. Calculations of SIF and T-stress. Cracks in actual and residual stress fields. Abstract: An advanced experimental technique for determination of the stress intensity factor (SIF) and the T-stress is developed and carefully verified. The approach employs optical interferometric measurements of local deformation response to small crack length increment. Narrow notches are used for crack modeling. Initial experimental data represent in-plane displacement component values measured by electronic speckle-pattern interferometry in the vicinity of the crack tip. Determination of the first four coefficients of Williams' series is the main feature of the developed technique. Relationships for transition from measured in-plane displacement components to required fracture mechanics parameters are presented. Availability of high-quality interference fringe patterns, which are free from rigid-body motion, serves as a reliable indicator of real strain state near the crack tip. Experimental verification of the proposed method is performed for non-symmetrical and symmetrical crack in thin rectangular plates subjected to uniaxial tension. The distributions of SIF and T-stress values for cracks of different length in residual stress fields near electronically welded joints of thin plates are presented as an example of practical implementing.